Thermoelectric Cooling Performance Enhancement in BiSeTe Alloy by Microstructure Modulation via Hot Extrusion.

ABSTRACT: The demand for high-performance materials in thermoelectric (TE) technology has driven continuous efforts to enhance the performance of commercialized Bi₂Te₃-based thermoelectric materials. Here, we report success in achieving significant performance improvements in n-type Bi₂Te_2.8Se_0.2S_0.01 through the implementation of a hot extrusion manufacturing process. This tailored manufacturing process has yielded a desired microstructure characterized by grain growth and preferred orientations. The resulting enlarged grain-based microstructure exhibits reduced dislocations and defects that originated from plastic deformation during extrusion and post annealing. As such, the charge carrier mobility is significantly enhanced, leading

SUBMITTER: Zhang Y 

PROVIDER: S-EPMC11935137 | biostudies-literature | 2024 Feb

REPOSITORIES: biostudies-literature