Atomic Layer Deposition of Nickel Oxides as Electrocatalyst for Oxygen Evolution Reaction.
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ABSTRACT: In this study, we present atomic layer deposition (ALD) of nickel oxides (NiOx) using a new nickel precursor, (methylcyclopentadienyl)(cyclopentadienyl)nickel (NiCp(MeCp)), and ozone (O3) as the oxygen source. The process features a relatively short saturation pulse of the precursor (NiCp(MeCp)) and a broad temperature window (150-250 °C) with a consistent growth rate of 0.39 Å per cycle. The NiOx film deposited at 250 °C primarily exhibits a polycrystalline cubic phase with minimal carbon contamination. Notably, the post-annealed ALD NiOx film demonstrates attractive electrocatalytic performance on the oxygen evolution reaction (OER) by providing a low overpotential of 320 mV at 10 mA cm-2, a low Tafel slope of 70.5 mV dec-1
SUBMITTER: Chen J
PROVIDER: S-EPMC11990215 | biostudies-literature | 2025 Mar
REPOSITORIES: biostudies-literature
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