Microparticle impact-induced bond strength in metals peaks with velocity.

ABSTRACT: Supersonic impact of metallic microparticles onto metallic substrates generates extreme interfacial deformation and high contact pressures, enabling solid-state metallic bonding. Although higher impact velocities are generally believed to improve bond quality and mechanical properties in materials formed by supersonic impact deposition, here we report a peak in bond strength for single microparticle impact bonding, followed by a decline at higher impact velocities. Our in situ micromechanical measurements of interfacial strength for Al microparticles bonded to Al substrates reveal a three-fold increase from the critical bonding velocity (800 m/s) to a peak strength around 1,060 m/s. Interestingly, further increase in impact velocity results in a rapid decline in local interfacial strength.

SUBMITTER: Tang Q 

PROVIDER: S-EPMC12002317 | biostudies-literature | 2025 Apr

REPOSITORIES: biostudies-literature