A 3.584 Tbps coherent receiver chip on InP-LiNbO₃ wafer-level integration platform.

ABSTRACT: The rapid advancement of the thin-film lithium niobate (LiNbO₃) platform has established it as a premier choice for high-performance photonics integrated circuits. However, the scalability and cost-efficiency of this platform are hindered by the reliance on chip-level fabrication and integration for passive and active components, necessitating a robust wafer-level LiNbO₃ heterogeneous integration platform. Despite its critical role in enabling ultrahigh-speed optical interconnects, as well as optical mmWave/THz sensing and communication, the realization of ultrahigh-speed photodiodes and optical coherent receivers on the LiNbO₃ platform remains an unresolved challenge. This is primarily due to the challenges associated with the large-scale integration of direct-bandga

SUBMITTER: Xie X 

PROVIDER: S-EPMC12032343 | biostudies-literature | 2025 Apr

REPOSITORIES: biostudies-literature