Chemical mechanical polishing as an alternative surface treatment technique for corrosion prevention of carbon steel in an acidic medium.

ABSTRACT: Chemical mechanical polishing (CMP) has been a standard technique in semiconductor manufacturing for achieving smooth surfaces. CMP utilizes a synergistic interplay of chemical and mechanical interactions to achieve the desired removal rates, selectivity, and ultimately planarity with different substrate materials. In this study, the impact of CMP on the surface properties of steel used in the petroleum industry was examined, with a focus on its corrosion behavior posttreatment. Steel samples were subjected to CMP with and without an oxidizer in a silica-based slurry, and their surface characteristics were compared to those of samples polished mechanically. The addition of an oxidizer to the slurry resulted in increased material removal rates and the formation of an oxide layer on the surf

SUBMITTER: Ahmed M 

PROVIDER: S-EPMC12044079 | biostudies-literature | 2025 Apr

REPOSITORIES: biostudies-literature