Exceptional Thermal Conductivity in Printed Dielectrics through Compositional and Microstructural Design.

ABSTRACT: As electronic devices become simultaneously more powerful and compact, thermal management is increasingly critical. Optimizing components like heatsinks is increasingly required, which has recently leveraged additive manufacturing. There is growing demand to move away from incumbent metallic materials for dielectric materials that are electrically insulative and  transparent to radio frequency signals. Thermally conductive polymer composites containing phonon-conducting ceramics offer a low-density dielectric solution compatible with fused filament fabrication. However, these materials have struggled to exceed thermal conductivities of 4 W m^-1 K^-1 due to challenging rheological flow effects at high filler volume fractions that prevent stable material extrusion. In thi

SUBMITTER: Braconnier DJ 

PROVIDER: S-EPMC12355452 | biostudies-literature | 2025 Aug

REPOSITORIES: biostudies-literature