Superior Adhesion of Monolayer Amorphous Carbon to Copper.

ABSTRACT: The single-atom thickness of graphene holds great potential for device scaling, but its effectiveness as a thin metal-ion diffusion barrier in microelectronics and a corrosion barrier for plasmonic devices is compromised by weak van der Waals interactions with copper (Cu), leading to delamination issues. In contrast, monolayer amorphous carbon (MAC), a recently reported single-atom-thick carbon film with a disordered sp² hybridized structure, demonstrates superior adhesion properties. This study reveals that MAC exhibits an adhesion energy of 85 J m^-2 on Cu, which is 13 times greater than that of graphene. This exceptional adhesion is attributed to the formation of covalent-like Cu─C bonds while preserving its sp² structure, as evidenced by X-ray photoelect

SUBMITTER: Zhang H 

PROVIDER: S-EPMC12355561 | biostudies-literature | 2025 Aug

REPOSITORIES: biostudies-literature