<i>In Situ</i> Atomic-Scale Investigation of Electromigration Behavior in Cu-Cu Joints at High Current Density.

ABSTRACT: Electromigration (EM) poses significant challenges to the reliability of miniaturized devices, particularly three-dimensional integrated circuits (3DICs) operating under high current densities. The EM phenomenon results from atomic-scale mechanisms involving momentum transfer between electron carriers and atoms. In this study, high-resolution transmission electron microscopy (HRTEM) was employed to investigate the atomic-scale behavior of EM in Cu-Cu joints. The analysis revealed that EM initially induced slip along various crystallographic planes, which gradually evolved into a stable slip along specific orientations, dominating the failure. This anisotropic atomic transport led to progressive degradation at the Cu-Cu bonding interface, including void formation and microstructural evoluti

SUBMITTER: Huang HJ 

PROVIDER: S-EPMC12392731 | biostudies-literature | 2025 Aug

REPOSITORIES: biostudies-literature