Simple Protein Foaming-Derived 3D Segregated MgO Networks in Epoxy Composites with Outstanding Thermal Conductivity Properties.

ABSTRACT: The miniaturization and high-power density of electronic devices present new challenges for thermal management. Efficient heat dissipation in electrically insulating packaging materials is currently limited by the thermal conductivity of thermal-interface materials (TIMs) and their ability to effectively direct heat toward heat sinks. In this study, MgO-based composites with high thermal conductivities are fabricated to achieve excellent thermal performances by optimizing the heat-transfer path. These composites are produced using a protein foaming method, which effectively forms interconnected ceramic-filler networks. Additionally, the liquid phase formed during the sintering of MgO enhances the bonding with the epoxy matrix, thereby improving the thermal conductivity of the composites. A

SUBMITTER: Ha SJ 

PROVIDER: S-EPMC12412586 | biostudies-literature | 2025 Sep

REPOSITORIES: biostudies-literature