Rational assembly of 3D network materials and electronics through tensile buckling.

ABSTRACT: Bioinspired network designs are widely exploited in biointegrated electronics and tissue engineering because of their high stretchability, imperfection insensitivity, high permeability, and biomimetic J-shaped stress-strain responses. However, the fabrication of three-dimensionally (3D) architected electronic devices with ordered constructions of network microstructures remains challenging. Here, we introduce the tensile buckling of stacked multilayer precursors as a unique route to 3D network materials with regularly distributed 3D microstructures. A data-driven topology optimization framework enables efficient search of the optimal 2D precursor pattern that maximizes out-of-plane dimension of the resulting 3D network material. Computational and experimental results demonstrate rational a

SUBMITTER: Hu X 

PROVIDER: S-EPMC12422206 | biostudies-literature | 2025 Sep

REPOSITORIES: biostudies-literature