Nano-Interconnected 1D/2D Boron Nitride Hybrid Networks: Unlocking Superior Thermal Conductivity in Electrically Insulating Thermal Interface Nanocomposites Based on Hybrid Thermal Percolation Model.

ABSTRACT: Due to its high thermal and low electrical conductivities, boron nitride (BN) has emerged as an optimal filler for thermal interface materials (TIMs) that prevent thermal condensation of nanostructures without causing shutdown due to electron tunneling. The polymer composite based on the BN hybrid strategy can be considered an optimal option as an electrically insulating and heat-dissipating TIM. However, there is a paucity of systematic experiments and theoretical approaches investigating the optimal content and ratio of BN hybrid fillers, which are key factors in synergistically improving thermal conductivity (TC). In this study, a hybrid thermal percolation model is developed by modifying the Foygel model to investigate the synergistic improvement in systematically measured TC. The mode

SUBMITTER: Jang SY 

PROVIDER: S-EPMC12464805 | biostudies-literature | 2025 Sep

REPOSITORIES: biostudies-literature