Stabilizing Cu⁰-Cu^δ+ sites via ohmic contact interface engineering for ampere-level nitrate electroreduction to ammonia.

ABSTRACT: The synergistic Cu⁰-Cu^δ+ sites are found as the active sites for NH₃ synthesis through nitrate electroreduction reaction, but still face significant challenges in stabilizing the Cu^δ+ due to its self-reduction. Here we propose an Ohmic contact interface engineering strategy by loading copper nano-islands on indium hydroxide nanocubes. Attributed to the lower work function of Cu than that of In(OH)₃ with n-type semiconductor nature, the electrons in Cu can transfer unimpededly to In(OH)₃ at the interface of Ohmic junction, triggering and stabilizing polarized Cu⁰-Cu^δ+ active sites. Cu@In(OH)₃ sustains both high NH₃ yield rate (4.28 mmol h^-1 mg_cat.^-1)

SUBMITTER: Li Z 

PROVIDER: S-EPMC12508171 | biostudies-literature | 2025 Oct

REPOSITORIES: biostudies-literature