Thin-Film Fracture Behavior for Diketopyrrolopyrrole Semiconducting Polymeric Films.

ABSTRACT: Fracture energy, which quantifies a material's resistance to the propagation of a pre-existing crack, is a key parameter for ensuring the mechanical reliability of stretchable organic electronic devices. However, most existing methods, such as a four-point bending fracture energy, utilized for measuring the fracture energy of semiconducting polymeric thin films are complicated by substrate effects, making it challenging to isolate the intrinsic behavior of the film from interfacial influences. In this study, we employed a pseudo free-standing pure shear method to systematically investigate the cohesive fracture energy of poly-(diketopyrrolopyrrole-terthiophene) P-(DPP-T)-based thin films to examine the effects of nanoconfinement, side chain length, degree of crystallinity, and strain rates

SUBMITTER: Zhang S 

PROVIDER: S-EPMC12529905 | biostudies-literature | 2025 Oct

REPOSITORIES: biostudies-literature