Post Wire-Bonding Corrosion Prevention Strategies to Mitigate Chloride- and Bromide-Induced Corrosion Failures in Cu- and PCC-Based Wire-Bonded Packages.

ABSTRACT: To ensure the highest safety standards in modern automobiles, the industry is constantly adopting zero-defect frameworks, such as AEC-Q100, which aims for defective-parts-per-billion (DPPB) or grade-0 level reliability standards in automotive integrated-circuit (IC) packages. Most contemporary wire-bonded packages use either pure copper (Cu) or palladium (Pd)-coated copper (PCC) wires bonded to aluminum (Al) bond pads as interconnections. This choice is made due to their lower cost and superior electrical and mechanical performance, compared to traditional gold wire-based devices. However, these Cu-Al wire-bonded interconnections are prone to ion-induced lift-off/open-circuit corrosion failures when exposed to even trace amounts (<20 ppm) of extrinsic and/or intrinsic halide (Cl^-

SUBMITTER: Kumaravel DK 

PROVIDER: S-EPMC12565955 | biostudies-literature | 2025 Oct

REPOSITORIES: biostudies-literature