A full-featured 2D flash chip enabled by system integration.
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ABSTRACT: Two-dimensional (2D) materials have extended the device scalability1-3 of silicon (Si) technology and enabled fundamental innovations in device mechanisms4-6. Both industry7-9 and academia10-13, particularly in the field of integrated circuits, are pursuing integration breakthroughs to demonstrate the superiority of 2D electronics at the system level. Despite considerable integration progress on either 2D material integration11-13 or 2D-CMOS hybrid integration14, a system that can migrate the advantages of the device to the application is still lacking. Here we report a full-featured 2D NOR flash memory chip realized by an atomic device to chip (ATOM2CHIP) technology, which combines a superior 2D electronic device as a memor
SUBMITTER: Liu C
PROVIDER: S-EPMC12571881 | biostudies-literature | 2025 Oct
REPOSITORIES: biostudies-literature
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