Unlocking the Essence of Lignin: High-Performance Adhesives That Bond via Thiol-Catechol Connectivities and Debond on Electrochemical Command.

ABSTRACT: The next generation of adhesives requires effective debonding capabilities that can be triggered on demand to enable advanced circular repair and recycling strategies. A new class of lignin-inspired, two-component (2K) structural adhesives offers bonding strengths of up to 20 MPa and clean, on-command electrochemical debonding within 5-30 min. The debonding is induced by a distinct electrochemical oxidation of thiol-catechol connectivities (TCCs) within the entire adhesive network, enforcing rapid and clean adhesive failure on the cathodic substrate side. The TCC-functionalities are formed during curing by a thiol-quinone Michael-type polyaddition, reacting polyester-based trithiols with tris-quinones as lignin-inspired minimal building blocks. The structural adhesive can be fine-tuned by

SUBMITTER: Walter K 

PROVIDER: S-EPMC12574627 | biostudies-literature | 2025 Oct

REPOSITORIES: biostudies-literature