Metal-hydrogel chelation interfaces for ultrasoft and bidirectional bioelectronics.

ABSTRACT: Emerging demand in soft bioelectronic systems poses critical challenges in stiffness control and end-to-end connections due to the huge modulus difference in various components. Here, a bidirectional electrical interface of hydrogel and metal electrodes to bridge soft skin/tissue and data collection circuits is enabled by coordination interactions. The dual-mode chelation including internal chelation and surface chelation effectively configures the cross-linking structure of hydrogel, as well as enhances the binding interface of metal-hydrogel complex surfaces. Internally, strong chelation competes with esterification, yielding tissue-like softness of hydrogel with an ultra-low modulus of ∼339.9 Pa. Externally, the hydrogel passivates the combined metal surfaces, promoting the formation of

SUBMITTER: Lu Y 

PROVIDER: S-EPMC12618001 | biostudies-literature | 2025 Nov

REPOSITORIES: biostudies-literature