Sample preparation induced artefacts in soft SAC solders from uncooled and cooled Argon ion milling.

ABSTRACT: Complex combinations of various materials in microelectronic packages pose challenges for sample preparation. Reliable cross-sectional sample preparation is critical for microstructural analysis, especially when utilising low-melting Sn-Ag-Cu (SAC) solders, which are easily deformed or damaged by mechanical grinding. Hence, this study explores the impact of femtosecond laser ablation for bulk material removal and subsequent Ar-ion milling for final cross-sectional polishing, comparing cooled and uncooled milling masks. We reveal that uncooled Ar-ion milling causes artefacts like increased surface roughness and fine Cu-rich structures due to surface heating combined with Cu redeposition on the preferentially milled, intruded SAC-surface. Cryogenic cooling of the milling mask to -100 °C redu

SUBMITTER: Cui C 

PROVIDER: S-EPMC12638915 | biostudies-literature | 2025 Nov

REPOSITORIES: biostudies-literature