CALPHAD-guided interlayer design for crack-free additive manufacturing of copper C18150 - Inconel 625 bimetallic structures.

ABSTRACT: Additive manufacturing (AM) of bimetallic structures combining copper alloys and Ni-based superalloys is critical for extreme environmental applications. However, interface cracking during fabrication persists due to thermophysical property mismatches. By implementing a CALPHAD-based ICME framework (CALPHAD: Calculation of Phase Diagrams; ICME: Integrated Computational Materials Engineering), we decode nonequilibrium solidification and phase stability to predict cracking susceptibility. Liquid phase separation emerges as the dominant mechanism, altering solute redistribution and thermal stress accumulation - a previously underexplored factor in bimetallic systems. Experiments using wire arc additive manufacturing (WAAM) validate model prediction: crack-free interfaces between C18150 and In

SUBMITTER: Wang L 

PROVIDER: S-EPMC12667290 | biostudies-literature | 2025

REPOSITORIES: biostudies-literature