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A Fully Si-Compatible Ni/Si<sub>3</sub>N<sub>4</sub>/Al<sub>2</sub>O<sub>3</sub>/<i>p</i> <sup>+</sup> Poly-Si RRAM Device for Analog Synapse and Its System-Level Assessment toward Processing-in-Memory Applications.


ABSTRACT: We propose a fully Si-compatible resistive-switching random-access memory (RRAM) device consisting of a Ni/Si3N4/Al2O3/p + poly-Si structure for processing-in-memory (PIM) applications fabricated through a process integration with Si CMOS compatibility. By introduction of an ultrathin Al2O3 tunneling layer between the Si3N4 switching layer and p + poly-Si bottom electrode, the leakage current in the high-resistance state (HRS) is suppressed, resulting in stable bipolar switching characteristics with a high on/off current ratio of approximately 104, maintained for more than 107 switching operations, as evidenced through durability measurements. Th

SUBMITTER: Lee Y 

PROVIDER: S-EPMC12676346 | biostudies-literature | 2025 Dec

REPOSITORIES: biostudies-literature