Robust Full-Surface Bonding of Substrate and Electrode for Ultra-Flexible Sensor Integration.

ABSTRACT: The integration of multiple flexible electronics is crucial for the development of ultra-flexible wearable and implantable devices. To fabricate an integrated system, robust and flexible bonding throughout the connection area, irrespective of the electrode or substrate, is needed. Conventional methods for flexible direct bonding have primarily been confined to metal electrodes or substrate-only bonding due to varying material properties. Consequently, the mechanical and electrical properties of the connections deteriorate based on their shape and size. This study introduces a bonding technique for wearable electronics, achieving strong, flexible connections between materials like gold and parylene at a low temperature (85 °C). This hybrid direct bonding method ensures strong bonding across

SUBMITTER: Takakuwa M 

PROVIDER: S-EPMC12691895 | biostudies-literature | 2025 Dec

REPOSITORIES: biostudies-literature