Post-Bonding Crack-Induced Di-Cantilever Bending (PBC-DCB): A Novel Method for Quantitative Evaluation of Bonding Strength for Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding.

ABSTRACT: To address the challenge of characterizing bonding strength in hybrid bonding, this paper proposes a method based on post-bonding crack-induced di-cantilever bending (PBC-DCB). The commonly used industrial blade insertion (BI) method only measures the edge strength of wafer-to-wafer samples via bevel geometry, failing to characterize the wafer center or die-to-wafer samples (as they lack a bevel) and exhibiting limited accuracy due to irregular crack edges. This study develops a di-cantilever beam test initiated by a specially prepared post-bonding notch. By deriving the relationship between load-displacement and bonding strength based on fracture mechanics and optimizing sample preparation and testing parameters, quantitative measurement of interface fracture strength is achieved. Experim

SUBMITTER: Zheng T 

PROVIDER: S-EPMC12734516 | biostudies-literature | 2025 Nov

REPOSITORIES: biostudies-literature