Nanoindentation Analysis of SU-8 Coated Wafers at Different Baking Phases.

ABSTRACT: SU-8 photoresist is extensively used as a structural and passivation layer in microelectromechanical systems, microfluidic devices, and related microscale technologies. The long-term reliability of these devices critically depends on the mechanical integrity and viscoelastic behaviour of the SU-8 coating. In this study, the mechanical and viscoelastic behaviour of SU-8 polymer thin films was systematically investigated using nanoindentation at different baking stages representative of standard photolithographic processing. SU-8 layers were spin-coated on silicon wafers and subjected to pre-bake, post-bake, and hard-bake treatments to evaluate the effects of progressive cross-linking. Static nanoindentation revealed that the elastic modulus did not change significantly during the baking pha

SUBMITTER: Tarjanyi T 

PROVIDER: S-EPMC12736521 | biostudies-literature | 2025 Dec

REPOSITORIES: biostudies-literature