Plasma-Modified Boron Nitride Nanosheets for High-Performance Aramid-Based Dielectric Films with Enhanced Multifunctionality.

ABSTRACT: Aramid paper, due to its lightweight structure, mechanical strength, and excellent dielectric performance, is widely employed in insulation systems of electronic devices and high-voltage equipment. However, its inherently poor thermal conductivity (λ) restricts its applicability in modern high-power systems with demanding thermal management needs. Additionally, conventional blending approaches often yield poor filler-matrix interfaces, which severely limit the enhancement of λ and simultaneously deteriorate other properties. Herein, a plasma-assisted amino functionalization approach is reported for boron nitride nanosheets to reinforce its interfacial affinity with 1D aramid nanofibers (ANF). Together with Silk Fibroin (SK), serving as a flexible molecular binder, a biomimetic nacre-inspir

SUBMITTER: Wang Z 

PROVIDER: S-EPMC12767117 | biostudies-literature | 2026 Jan

REPOSITORIES: biostudies-literature