3D Hierarchical Cu Nanowire Scaffolds with Rest-Free Symmetric Pulsed Plating/Stripping for Stable Lithium-Metal Anodes.

ABSTRACT: Stabilizing lithium-metal anodes requires cooptimization of the current-collector surface architecture and the deposition protocol. In this study, morphology-controlled Cu-based scaffolds were integrated with symmetric, rest-free pulse-current strategies. Three Cu nanostructures-nanoneedles (NN), 3D hierarchical nanowires (HN), and pinecone-like nanostructures (PLN)-were fabricated by linear sweep voltammetry; CuO-rich HN afforded the most uniform Li nucleation. Pulse durations of 100 ms, 500 ms, and 1 s were then screened; 500 ms was identified as the optimal condition, offering the best compromise between deposition uniformity and interfacial stability. Finally, three protocols were compared at 500 ms: plating/stripping (P-S), plating/rest (P-R), and plating/rest/stripping/rest (P-R-S-R)

SUBMITTER: Choi Y 

PROVIDER: S-EPMC12767272 | biostudies-literature | 2025 Nov

REPOSITORIES: biostudies-literature