Wafer-level self-packaged MEMS infrared emitters with high-emissivity black silicon surface.

ABSTRACT: Infrared (IR) gas sensors have an urgent demand for high-reliability MEMS IR emitters. In this study, a wafer-level self-packaged MEMS IR emitter (SPIRE) has been designed and manufactured to enhance the durability of devices in high temperatures and ambient air. In the state-of-the-art design, Pt-wire heating and temperature sensing elements were fabricated onto a silicon (Si) membrane and vacuum-sealed within a glass cavity utilizing the Si-glass anodic bonding technique. Additionally, a black-Si nanostructure was prepared on the opposite side of the Si membrane to enhance IR light emissivity. The electrical-thermal-mechanical properties were simulated using COMSOL Multiphysics to optimize the structural design. The devices were fabricated through wafer-level MEMS processing techniques.

SUBMITTER: Li Z 

PROVIDER: S-EPMC12796358 | biostudies-literature | 2026 Jan

REPOSITORIES: biostudies-literature