Chemical Mechanical Polishing of Plasma-Modified Cu/Polymer Interfaces for Advanced Hybrid Bonding.

ABSTRACT: Hybrid bonding, referring to direct bonding between metal and insulator layers, has become a key technology for next-generation semiconductor packaging, enabling high-density interconnects, fast signal transmission, and a compact form factor. Polymer dielectrics such as benzocyclobutene (BCB) provide excellent insulation and adhesion but pose challenges for chemical mechanical polishing (CMP) due to their viscoelasticity. Here, a CMP-compatible strategy based on argon (Ar) plasma modification of BCB is proposed to enable effective planarization of Cu/BCB hybrid bonding interfaces. Ar plasma treatment increases surface hardness and brittleness of half-cured BCB and increases hydrophilicity. The resulting wrinkle structures improve the flow of abrasive particles and slurry, enabling a plowin

SUBMITTER: Kang S 

PROVIDER: S-EPMC12806195 | biostudies-literature | 2026 Jan

REPOSITORIES: biostudies-literature