Long-term high-temperature aging mechanism of copper-metallized through-glass vias: a combined nanoindentation test and hybrid Potts-phase field simulation study.

ABSTRACT: The reliability of through-glass via (TGV) interconnects is critical for advanced semiconductor packaging. This work investigates microstructural and mechanical evolution in electroplated TGV-Cu subjected to long-term aging at 250 °C. TGV samples were fabricated via laser-induced etching and double-sided copper electroplating, then aged for up to 1008 h. Nanoindentation revealed region-dependent reductions in hardness (from 2.0-2.5 GPa to below 0.5 GPa) and modulus (from 110-130 GPa to 40-90 GPa), with surface-near regions most affected. The glass substrate maintained stable mechanical properties until microcracks formed after 1008 h. EBSD quantification showed grain-size enlargement from 0.46 µm to 1.86 µm and a concurrent decrease in dislocation density. Molecular dynamics simulations of

SUBMITTER: Chen J 

PROVIDER: S-EPMC12862051 | biostudies-literature | 2026 Feb

REPOSITORIES: biostudies-literature