Influence of Pd Coating Thickness and Pd Content in Sn-Based Solders on Interfacial IMC Formation and Microstructural Evolution in Solder/Ni Joints.

ABSTRACT: Interfacial reactions between Sn-based solders and Au/Pd/Ni metallization were investigated at 260 °C, with particular emphasis on the effects of Pd and Sn thicknesses. Au/Pd/Ni substrates with Pd layers of approximately 70 nm, 200 nm, and 1 µm were reacted with Sn layers of about 50, 20, and 10 µm. Additionally, Sn-Pd and Sn-3Ag-Pd solders containing 0.1-1 wt.% Pd were reacted with Ni substrates. In the Sn/Au/Pd/Ni reactions, rapid dissolution of the Pd layer and partial Ni dissolution at the early stage promoted the formation of large amounts of faceted (Pd,Ni)Sn₄. With increasing reaction time, continuous Ni diffusion enriched the interfacial region, leading to the nucleation and growth of Ni₃Sn₄. Once the Ni solubility limit in (Pd,Ni)Sn₄ was

SUBMITTER: Wang CH 

PROVIDER: S-EPMC12898616 | biostudies-literature | 2026 Jan

REPOSITORIES: biostudies-literature