Metallic copper corrosion rates, moisture content, and growth medium influence survival of copper ion-resistant bacteria.

ABSTRACT: The rapid killing of various bacteria in contact with metallic copper is thought to be influenced by the influx of copper ions into the cells, but the exact mechanism is not fully understood. This study showed that the kinetics of contact killing of copper surfaces depended greatly on the amount of moisture present, copper content of alloys, type of medium used, and type of bacteria. We examined antibiotic- and copper ion-resistant strains of Escherichia coli and Enterococcus faecium isolated from pig farms following the use of copper sulfate as feed supplement. The results showed rapid killing of both copper ion-resistant E. coli and E. faecium strains when samples in rich medium were spread in a thin, moist layer on copper alloys with 85% or greater copper content. E. coli strains were r

SUBMITTER: Elguindi J 

PROVIDER: S-EPMC3991429 | biostudies-literature | 2011 Mar

REPOSITORIES: biostudies-literature