Efficient Direct Reduction of Graphene Oxide by Silicon Substrate.

ABSTRACT: Graphene has been studied for various applications due to its excellent properties. Graphene film fabrication from solutions of graphene oxide (GO) have attracted considerable attention because these procedures are suitable for mass production. GO, however, is an insulator, and therefore a reduction process is required to make the GO film conductive. These reduction procedures require chemical reducing agents or high temperature annealing. Herein, we report a novel direct and simple reduction procedure of GO by silicon, which is the most widely used material in the electronics industry. In this study, we also used silicon nanosheets (SiNSs) as reducing agents for GO. The reducing effect of silicon was confirmed by various characterization methods. Furthermore, the silicon wafer was also us

SUBMITTER: Lee SC 

PROVIDER: S-EPMC4648420 | biostudies-literature | 2015 Jul

REPOSITORIES: biostudies-literature