Microassembly of Heterogeneous Materials using Transfer Printing and Thermal Processing.

ABSTRACT: Enabling unique architectures and functionalities of microsystems for numerous applications in electronics, photonics and other areas often requires microassembly of separately prepared heterogeneous materials instead of monolithic microfabrication. However, microassembly of dissimilar materials while ensuring high structural integrity has been challenging in the context of deterministic transferring and joining of materials at the microscale where surface adhesion is far more dominant than body weight. Here we present an approach to assembling microsystems with microscale building blocks of four disparate classes of device-grade materials including semiconductors, metals, dielectrics, and polymers. This approach uniquely utilizes reversible adhesion-based transfer printing for material tr

SUBMITTER: Keum H 

PROVIDER: S-EPMC4947911 | biostudies-literature | 2016 Jul

REPOSITORIES: biostudies-literature