Crosslinked polyarylene ether nitrile film as flexible dielectric materials with ultrahigh thermal stability.

ABSTRACT: Dielectric film with ultrahigh thermal stability based on crosslinked polyarylene ether nitrile is prepared and characterized. The film is obtained by solution-casting of polyarylene ether nitrile terminated phthalonitrile (PEN-Ph) combined with post self-crosslinking at high temperature. The film shows a 5% decomposition temperature over 520 °C and a glass transition temperature (T_g) around 386 °C. Stable dielectric constant and low dielectric loss are observed for this film in the frequency range of 100-200 kHz and in the temperature range of 25-300 °C. The temperature coefficient of dielectric constant is less than 0.001 °C^-1 even at 400 °C. By cycling heating and cooling up to ten times or heating at 300 °C for 12 h, the film shows good reversibility and robustnes

SUBMITTER: Yang R 

PROVIDER: S-EPMC5101497 | biostudies-literature | 2016 Nov

REPOSITORIES: biostudies-literature