Microfluidic Patterning of Metal Structures for Flexible Conductors by In Situ Polymer-Assisted Electroless Deposition.

ABSTRACT: A low-cost, solution-processed, versatile, microfluidic approach is developed for patterning structures of highly conductive metals (e.g., copper, silver, and nickel) on chemically modified flexible polyethylene terephthalate thin films by in situ polymer-assisted electroless metal deposition. This method has significantly lowered the consumption of catalyst as well as the metal plating solution.

SUBMITTER: Liang S 

PROVIDER: S-EPMC5323856 | biostudies-literature | 2017 Feb

REPOSITORIES: biostudies-literature