Tin, Bismuth, and Tin-Bismuth Alloy Electrodeposition from Chlorometalate Salts in Deep Eutectic Solvents.

ABSTRACT: The electrodeposition of tin, bismuth, and tin-bismuth alloys from Sn^II and Bi^III chlorometalate salts in the choline chloride/ethylene glycol (1:2 molar ratio) deep eutectic solvent was studied on glassy carbon and gold by cyclic voltammetry, rotating disc voltammetry, and chronoamperometry. The Sn^II-containing electrolyte showed one voltammetric redox process corresponding to Sn^II/Sn⁰. The diffusion coefficient of [SnCl₃]^-, detected as the dominating species by Raman spectroscopy, was determined from Levich and Cottrell analyses. The Bi^III-containing electrolyte showed two voltammetric reduction processes, both attributed to Bi^III/Bi⁰. Dimensionless current/time transients reveal

SUBMITTER: Vieira L 

PROVIDER: S-EPMC5474671 | biostudies-literature | 2017 Jun

REPOSITORIES: biostudies-literature