In-chip microstructures and photonic devices fabricated by nonlinear laser lithography deep inside silicon.

ABSTRACT: Silicon is an excellent material for microelectronics and integrated photonics1-3 with untapped potential for mid-IR optics4. Despite broad recognition of the importance of the third dimension5,6, current lithography methods do not allow fabrication of photonic devices and functional microelements directly inside silicon chips. Even relatively simple curved geometries cannot be realised with techniques like reactive ion etching. Embedded optical elements, like in glass7, electronic devices, and better electronic-photonic integration are lacking8. Here, we demonstrate laser-based fabrication of complex 3D structures deep inside silicon using 1 µm-sized dots and rod-like structures of adjustable length as basic building blocks. The laser-modified Si has a different optical index than unmodif

SUBMITTER: Tokel O 

PROVIDER: S-EPMC5624509 | biostudies-literature | 2017 Oct

REPOSITORIES: biostudies-literature