Improved electrical and thermo-mechanical properties of a MWCNT/In-Sn-Bi composite solder reflowing on a flexible PET substrate.

ABSTRACT: Multi-walled carbon nanotube (MWCNT)/indium-tin-bismuth (In-Sn-Bi) composite nanostructures in which In-Sn-Bi nanoparticles have been penetrated by the MWCNT arrays were synthesized using a chemical reduction method. The incorporation of 0.6 wt% MWCNTs with high electrical conductivity into the In-based solder resulted in low minimum electrical resistivity (19.9 ± 1.0 µΩ·cm). Despite being reflowed at the relatively low temperature of 110 °C, the composite solder nanostructures were able to form mechanically stable solder bumps on a flexible polyethylene terephthalate (PET) substrate due to the MWCNT arrays with a high thermal conductivity of 3000 W/(m·K) and In-Sn-Bi nanoparticles with a low melting temperature of 98.2 °C. Notably, the composite solder bumps exhibited high flexibility (17

SUBMITTER: Kim SH 

PROVIDER: S-EPMC5653769 | biostudies-literature | 2017 Oct

REPOSITORIES: biostudies-literature