Growth kinetics of Cu₆Sn₅ intermetallic compound in Cu-liquid Sn interfacial reaction enhanced by electric current.

ABSTRACT: In this paper, electric currents with the densities of 1.0 × 10² A/cm² and 2.0 × 10² A/cm² were imposed to the Cu-liquid Sn interfacial reaction at 260 °C and 300 °C with the bonding times from 15 min to 960 min. Unlike the symmetrical growth following a cubic root dependence on time during reflowing, the Cu₆Sn₅ growth enhanced by solid-liquid electromigration followed a linear relationship with time. The elevated electric current density and reaction temperature could greatly accelerate the growth of Cu₆Sn₅, and could induce the formation of cellular structures on the surfaces because of the constitutional supercooling effect. A growth kinetics model of Cu₆Sn₅ based on Cu concentr

SUBMITTER: Feng J 

PROVIDER: S-EPMC5788868 | biostudies-literature | 2018 Jan

REPOSITORIES: biostudies-literature