Low-Yellowing Phosphor-in-Glass for High-Power Chip-on-board White LEDs by Optimizing a Low-Melting Sn-P-F-O Glass Matrix.

ABSTRACT: We introduce a low-melting-point (MP) Sn-P-F-O glass ceramic material into the phosphor-in-glass (PIG) material to realize an 'on-chip' chip-on-board (COB) type of phosphor-converted (pc) white light-emitting diode (WLED) with green (BaSr)₂SiO₄:Eu²⁺ and red (SrCa)AlSiN₃:Eu²⁺ (SCASN) phosphors. The optimum Sn-P-F-O-based ceramic components can be sintered into the glass phase with a facile one-step heating process at 285 °C for 1 min. Specifically, these soft-fabrication conditions can be optimized to minimize the degradation of the luminescent properties of the red SCASN phosphor as well as the green silicate phosphor in PIG-based white COB-type pc-LEDs owing to the low thermal loss of the phosphors at low fabrication temperatures belo

SUBMITTER: Yoon HC 

PROVIDER: S-EPMC5943285 | biostudies-literature | 2018 May

REPOSITORIES: biostudies-literature