Wafer-recyclable, environment-friendly transfer printing for large-scale thin-film nanoelectronics.

ABSTRACT: Transfer printing of thin-film nanoelectronics from their fabrication wafer commonly requires chemical etching on the sacrifice of wafer but is also limited by defects with a low yield. Here, we introduce a wafer-recyclable, environment-friendly transfer printing process that enables the wafer-scale separation of high-performance thin-film nanoelectronics from their fabrication wafer in a defect-free manner that enables multiple reuses of the wafer. The interfacial delamination is enabled through a controllable cracking phenomenon in a water environment at room temperature. The physically liberated thin-film nanoelectronics can be then pasted onto arbitrary places of interest, thereby endowing the particular surface with desirable add-on electronic features. Systematic experimental, theore

SUBMITTER: Wie DS 

PROVIDER: S-EPMC6077709 | biostudies-literature | 2018 Jul

REPOSITORIES: biostudies-literature