Assembly of a 3D Cellular Computer Using Folded E-Blocks.

ABSTRACT: The assembly of integrated circuits in three dimensions (3D) provides a possible solution to address the ever-increasing demands of modern day electronic devices. It has been suggested that by using the third dimension, devices with high density, defect tolerance, short interconnects and small overall form factors could be created. However, apart from pseudo 3D architecture, such as monolithic integration, die, or wafer stacking, the creation of paradigms to integrate electronic low-complexity cellular building blocks in architecture that has tile space in all three dimensions has remained elusive. Here, we present software and hardware foundations for a truly 3D cellular computational devices that could be realized in practice. The computing architecture relies on the scalable, self-confi

SUBMITTER: Pandey S 

PROVIDER: S-EPMC6189794 | biostudies-literature | 2016 Apr

REPOSITORIES: biostudies-literature