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Large-Area and High-Throughput PDMS Microfluidic Chip Fabrication Assisted by Vacuum Airbag Laminator.


ABSTRACT: One of the key fabrication steps of large-area microfluidic devices is the flexible-to-hard sheet alignment and pre-bonding. In this work, the vacuum airbag laminator (VAL) which is commonly used for liquid crystal display (LCD) production has been applied for large-area microfluidic device fabrication. A straightforward, efficient, and low-cost method has been achieved for 400 × 500 mm² microfluidic device fabrication. VAL provides the advantages of precise alignment and lamination without bubbles. Thermal treatment has been applied to achieve strong PDMS⁻glass and PDMS⁻PDMS bonding with maximum breakup pressure of 739 kPa, which is comparable to interference-assisted thermal bonding method. The fabricated 152 × 152 mm² microfluidic chip has been successfully applied for droplet generation and splitting.

SUBMITTER: Xie S 

PROVIDER: S-EPMC6190007 | biostudies-literature | 2017 Jul

REPOSITORIES: biostudies-literature

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Large-Area and High-Throughput PDMS Microfluidic Chip Fabrication Assisted by Vacuum Airbag Laminator.

Xie Shuting S   Wu Jun J   Tang Biao B   Zhou Guofu G   Jin Mingliang M   Shui Lingling L  

Micromachines 20170712 7


One of the key fabrication steps of large-area microfluidic devices is the flexible-to-hard sheet alignment and pre-bonding. In this work, the vacuum airbag laminator (VAL) which is commonly used for liquid crystal display (LCD) production has been applied for large-area microfluidic device fabrication. A straightforward, efficient, and low-cost method has been achieved for 400 × 500 mm² microfluidic device fabrication. VAL provides the advantages of precise alignment and lamination without bubb  ...[more]

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