Cleaning interfaces in layered materials heterostructures.

ABSTRACT: Heterostructures formed by stacking layered materials require atomically clean interfaces. However, contaminants are usually trapped between the layers, aggregating into randomly located blisters, incompatible with scalable fabrication processes. Here we report a process to remove blisters from fully formed heterostructures. Our method is over an order of magnitude faster than those previously reported and allows multiple interfaces to be cleaned simultaneously. We fabricate blister-free regions of graphene encapsulated in hexagonal boron nitride with an area ~ 5000 μm², achieving mobilities up to 180,000 cm² V^-1 s^-1 at room temperature, and 1.8 × 10⁶ cm² V^-1 s^-1 at 9 K. We also assemble heterostructure

SUBMITTER: Purdie DG 

PROVIDER: S-EPMC6300598 | biostudies-literature | 2018 Dec

REPOSITORIES: biostudies-literature