Solid-Liquid Interdiffusion (SLID) Bonding of p-Type Skutterudite Thermoelectric Material Using Al-Ni Interlayers.

ABSTRACT: Over the past few years, significant progress towards implementation of environmentally sustainable and cost-effective thermoelectric power generation has been made. However, the reliability and high-temperature stability challenges of incorporating thermoelectric materials into modules still represent a key bottleneck. Here, we demonstrate an implementation of the Solid-Liquid Interdiffusion technique used for bonding Mmy(Fe,Co)₄Sb12 p-type thermoelectric material to metallic interconnect using a novel aluminium⁻nickel multi-layered system. It was found that the diffusion reaction-controlled process leads to the formation of two distinct intermetallic compounds (IMCs), Al₃Ni and Al₃Ni₂, with a theoretical melting point higher than the initial bonding temperature. Different manufacturing p

SUBMITTER: Placha K 

PROVIDER: S-EPMC6317193 | biostudies-literature | 2018 Dec

REPOSITORIES: biostudies-literature