Ambient Aqueous-Phase Synthesis of Copper Nanoparticles and Nanopastes with Low-Temperature Sintering and Ultra-High Bonding Abilities.

ABSTRACT: Copper nanoparticles (NPs) with an average particle diameter of 50-60 nm were successfully obtained by reducing an aqueous solution of a copper(II)-nitrilotriacetic acid complex with an aqueous hydrazine solution at room temperature under an air atmosphere. Copper NP-based nanopastes were printed onto a glass substrate using a metal screen mask and pressureless sintered under a nitrogen atmosphere at 200 °C for 30 min. The electrical resistivity of the resulting copper electrode was 16 μΩ · cm. For a metal-to-metal bonding test, copper nanopaste was printed on an oxygen-free copper plate, another oxygen-free copper plate was placed on top, and the bonding strength between the copper plates when pressureless sintered under a nitrogen atmosphere at 200 °C for 30 min was 39 MPa. TEM observati

SUBMITTER: Kamikoriyama Y 

PROVIDER: S-EPMC6349850 | biostudies-literature | 2019 Jan

REPOSITORIES: biostudies-literature