Conformal hexagonal-boron nitride dielectric interface for tungsten diselenide devices with improved mobility and thermal dissipation.

ABSTRACT: Relatively low mobility and thermal conductance create challenges for application of tungsten diselenide (WSe₂) in high performance devices. Dielectric interface is of extremely importance for improving carrier transport and heat spreading in a semiconductor device. Here, by near-equilibrium plasma-enhanced chemical vapour deposition, we realize catalyst-free growth of poly-crystalline two-dimensional hexagonal-boron nitride (2D-BN) with domains around 20~ 200 nm directly on SiO₂/Si, quartz, sapphire, silicon or SiO₂/Si with three-dimensional patterns at 300 °C. Owing to the atomically-clean van-der-Walls conformal interface and the fact that 2D-BN can better bridge the vibrational spectrum across the interface and protect interfacial heat conduction agains

SUBMITTER: Liu D 

PROVIDER: S-EPMC6416324 | biostudies-literature | 2019 Mar

REPOSITORIES: biostudies-literature