High Precision Thermoforming 3D-Conformable Electronics with a Phase-Changing Adhesion Interlayer.

ABSTRACT: Modern design-conscious products have raised the development of advanced electronic fabricating technologies. These widely used industrial technologies show high compatibility for inorganic materials and capacity for mass production. However, the morphology accuracy is hard to ensure and cracks happen easily, which could cause the degradation of device performance and life span. In order to make high precision 3D conformable electronics, a thermal phase-changing adhesion interlayer and modified fabricating processes are used in self-developed equipment. The working principles and influencing factors such as heating time and geometry parameters are studied quantitatively. The accuracy of fabricated patterns is enhanced by this new technology and serpentine designed structures. The delaminat

SUBMITTER: Wu K 

PROVIDER: S-EPMC6471248 | biostudies-literature | 2019 Feb

REPOSITORIES: biostudies-literature