Atomic-scale diffusion rates during growth of thin metal films on weakly-interacting substrates.

ABSTRACT: We use a combined experimental and theoretical approach to study the rates of surface diffusion processes that govern early stages of thin Ag and Cu film morphological evolution on weakly-interacting amorphous carbon substrates. Films are deposited by magnetron sputtering, at temperatures T_S between 298 and 413 K, and vapor arrival rates F in the range 0.08 to 5.38 monolayers/s. By employing in situ and real-time sheet-resistance and wafer-curvature measurements, we determine the nominal film thickness Θ at percolation (Θ_perc) and continuous film formation (Θ_cont) transition. Subsequently, we use the scaling behavior of Θ_perc and Θ_cont as a function of F and T_s, to estimate, experimentally, the temperature-dependent diffusiv

SUBMITTER: Jamnig A 

PROVIDER: S-EPMC6488595 | biostudies-literature | 2019 Apr

REPOSITORIES: biostudies-literature