Mechanically strengthened graphene-Cu composite with reduced thermal expansion towards interconnect applications.

ABSTRACT: High-density integration technologies with copper (Cu) through-silicon via (TSV) have emerged as viable alternatives for achieving the requisite integration densities for the portable electronics and micro-electro-mechanical systems (MEMSs) package. However, significant thermo-mechanical stresses can be introduced in integrated structures during the manufacturing process due to mismatches of thermal expansion and the mechanical properties between Cu and silicon (Si). The high-density integration demands an interconnection material with a strong mechanical strength and small thermal expansion mismatch. In this study, a novel electroplating method is developed for the synthesis of a graphene-copper (G-Cu) composite with electrochemically exfoliated graphenes. The fabrication and evaluation o

SUBMITTER: An Z 

PROVIDER: S-EPMC6526160 | biostudies-literature | 2019

REPOSITORIES: biostudies-literature