Highly stacked 3D organic integrated circuits with via-hole-less multilevel metal interconnects.

ABSTRACT: Multilevel metal interconnects are crucial for the development of large-scale organic integrated circuits. In particular, three-dimensional integrated circuits require a large number of vertical interconnects between layers. Here, we present a novel multilevel metal interconnect scheme that involves solvent-free patterning of insulator layers to form an interconnecting area that ensures a reliable electrical connection between two metals in different layers. Using a highly reliable interconnect method, the highest stacked organic transistors to date, a three-dimensional organic integrated circuits consisting of 5 transistors and 20 metal layers, is successfully fabricated in a solvent-free manner. All transistors exhibit outstanding device characteristics, including a high on/off current r

SUBMITTER: Yoo H 

PROVIDER: S-EPMC6546689 | biostudies-literature | 2019 Jun

REPOSITORIES: biostudies-literature